MSc L. Pakula

1. A 0.05mm² 1V capacitance-to-digital converter based on period modulation
   Y. He; Z. Y. Chang; L. Pakula; S. H. Shalmany; M. Pertijs;
   In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
   IEEE, pp. 486‒487, February 2015. DOI: 10.1109/ISSCC.2015.7063138
   
   Abstract: ...

   This paper presents a digitally assisted period modulation (PM)-based capacitance-to-digital converter (CDC) that is >9× smaller than prior CDCs with >10b resolution, and improves the energy efficiency by >10× compared to previous PM-based CDCs. This is achieved with the help of a piece-wise charge transfer technique that eliminates the need for a large on-chip integration capacitor, a dual-integration-capacitor scheme that reduces the front-end noise contribution, a sampled-biasing technique that reduces the noise of the integration current, and a current-efficient inverter-based design.

2. Fabrication of nanofluidic devices in glass with polysilicon electrodes
   V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
   Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
   Volume 123-124, pp. 602-607, 2005. 100% EI.

3. Fabrication of nanofluidic devices using glass-to-glass anodic bonding
   V.G. Kutchoukov; F. Laugere; W. van der Vlist; L. Pakula; Y. Garini; A. Bossche;
   Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers,
   Volume 114, Issue 2-3, pp. 521-527, 2004. phpub 18.

4. Nanofluidic devices in glass with Poly-Si electrodes
   V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; L.K. Nanver; A. Bossche;
   In s.n. (Ed.), SAFE 337f38aeae344dd3ad3d46be444f765b ProRISC 2004; Proceedings of semiconductor advances for future electronics,
   STW Technology Foundation, pp. 764-768, 2004.

5. Nanochannels in Glass with Poly-Silicon Electrodes
   V.G. Kutchoukov; L. Pakula; G.O.F. Parikesit; Y. Garini; L.K. Nanver; A. Bossche;
   In s.n. (Ed.), Technical Digest of Eurosensors XVIII,
   s.n., pp. 32-35, 2004. phpub 40.

6. Processing of inertial sensors using SF6-O2 Cryogenic plasma process
   G. Craciun; H. Yang; L. Pakula; M.A. Blauw;
   In s.n. (Ed.), SAFE 2003 Semiconductor advances for future electronics,
   Stichting voor de Technische Wetenschappen, pp. 683-686, 2003. CD-ROM.

7. Fabrication of nanochannels using glass to glass anodic bonding
   V.G. Kutchoukov; F.P.J. Laugere; W. van der Vlist; L. Pakula; Y. Garini; P.F.A. Alkemade; A. Bossche;
   In s.n. (Ed.), TRANSDUCERS'03 Twelfth international conference on solid-state sensors, actuators and microsystems,
   IEEE, pp. 1327-1330, 2003. CD-ROM.

8. Nanochannel fabrication technique for fluidic applications
   V.G. Kutchoukov; L. Pakula; Y. Garini; J.R. Mollinger; A. Bossche;
   In s.n. (Ed.), SAFE 2003 Semiconductor advances for future electronics,
   Stichting voor de Technische Wetenschappen, pp. 702-706, 2003. CD-ROM.

9. Fabrication technology for nanofluidic channel devices for biochemical applications
   V.G. Kutchoukov; L. Pakula; Y. Garini; J.R. Mollinger; A. Bossche;
   In s.n. (Ed.), MME 2003 14th Micromechanics Europe workshop,
   s.n., pp. 167-170, 2003.

10. Fabrication technology for twin nanochannels
    V.G. Kutchoukov; L. Pakula; J.R. Mollinger; A. Bossche;
    In s.n. (Ed.), EUROSENSORS 17th European conference on solid-state transducers,
    University of Minho, pp. 623-626, 2003. CD-ROM.

11. In-situ doped PECVD SiC for surface micromachined devices
    C.R. de Boer; L. Pakula; P.M. Sarro; T.M.H. Pham;
    In J Saneistr; P Ripka (Ed.), Eurosensors XVI 16th European Conference on Solid-State Transducers,
    Czech Technical University, pp. 232-235, 2002.

12. Influence of deposition parameters and temperature on stress and strain of In Situ doped PECVD silicon carbide
    T.M.H. Pham; C.R. de Boer; L. Pakula; P.M. Sarro;
    In S Yoshida (Ed.), ICSCRM2001 Proceedings of the International Conference on Silicon Carbide and Related Materials,
    Trans Tech Publications, pp. 759-762, 2002.

13. Dry etching release of structures in post-processing surface micromachining using polyimide as a sacrificial layer
    A. Bagolini; H.M.T. Pham; T.L.M. Scholtes; L. Pakula; P.M. Sarro;
    In SAFE2001: proceedings,
    STW Technology Foundation, pp. 769-772, 2001.

14. Coplanar waveguides and butt-joints on InP
    J.H. den Besten; D. Caprioli; L. Pakula; E. Smalbrugge; T. de Vries; J.J.M. Kwaspen; A.W. Roodnat; R. van Dijk; {van Vliet}, FE; XJM Leijtens; MK Smit;
    In {H Thienpont} (Ed.), Proceedings,
    VUBPress, pp. 197-200, 2001.

15. Polyimide sacrificial layer for postprocessing surface micromachining
    A. Bagolini; T.L.M. Scholtes; H.M.T. Pham; L. Pakula; P.M. Sarro;
    In MME 2001,
    s.n., pp. 58-61, 2001.

BibTeX support